メッキ技術エンジニア/ Plating Technology Engineer

An international manufacturing company is looking for a Plating Technology Engineer. The selected candidate will develop and evaluate plating materials, chemistries, and processes, conduct structured experiments, solve technical issues, and collaborate with R&D, Product Development, Manufacturing, and global engineering teams.

Responsibilities:

• Develop plating technologies for connector applications, including new plating materials, chemistries, and processes
• Establish relationships between plating chemistry, process parameters, deposit properties, and functional performance
• Plan and execute structured experiments and DOE with Japan R&D, plating teams, and GME
• Translate customer and product requirements into plating technology development activities with Product Development, R&D, Manufacturing, and global engineering teams
• Investigate root causes and resolve plating-related material, process, corrosion, reliability, and performance issues
• Identify and evaluate emerging plating technologies, regional suppliers, and technology partners in Japan
• Contribute to the long-term plating technology roadmap by identifying capability gaps, development opportunities, and future technology needs

Requirements:

• Experience in electroplating, surface finishing, electrochemistry, materials engineering, or related process or technology development
• Hands-on experience in plating process development, experimentation, or technical problem-solving
• Understanding of the relationship between process conditions, material and deposit properties, and functional performance
• Experience planning and executing structured experiments, including DOE or equivalent systematic development approaches
• Ability to work independently and collaborate effectively across R&D, Product Development, Manufacturing, and global engineering teams
• Native level Japanese; intermediate business level English

Preferred requirements:

• Experience with connector or contact plating technologies, including Ni, Au, Ag, Sn, NiP, or related surface finishes
• Experience with supplier qualifications, new technology evaluation, or technology scouting
• Experience with characterisation techniques such as XRF, SEM/EDS, FIB, surface analysis, or electrochemical methods

About the Company:

This company operates in the global manufacturing industry, developing connector and related technology solutions. It works with R&D, product development, manufacturing, and engineering teams across international markets.

Keywords:

めっき技術, めっき技術開発, 電気めっき, 表面処理, 電気化学, 材料工学, コネクター, めっきプロセス, めっき材料, 技術開発, サプライヤー評価, 根本原因分析, 求人, 外資系

Job Ref: J4HWBC