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リード ファブ テクノロジー エンジニア/ Lead Fab Technology Engineer

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A global manufacturing company is looking for a Lead Fab Technology Engineer, Surface Preparation and Integration (SPI). The selected candidate will lead technical and customer-facing initiatives to support SPI business growth across Asia.

Responsibilities:

  • Act as technical expert in SPI, leading customer evaluations and application support
  • Develop and execute strategies to grow SPI material revenue and market share
  • Support customer qualifications and collaborate with account managers on product presentations
  • Build strong relationships with key customers and OEMs to identify new opportunities
  • Lead SPI product positioning, lifecycle management, and regional technical roadmap discussions
  • Collaborate with cross-functional teams and represent the region in business reviews

Requirements:

  • Bachelor’s degree or above in chemistry or chemical engineering, material science, or engineering
  • 8-10 years of experience in Wet Etch and clean area in semiconductors processing or fab environment, equipment supplier, or material supplier
  • Experience in Surface Analytical techniques is preferred
  • Prior experience in sales or management is ideal
  • Proficient in verbal English (TOEIC 600+ is ideal)

About the Company:

A global manufacturing company which specialises in providing products used in advanced technology manufacturing such as semiconductor device fabrication. The company holds several thousands of patents.

Keywords:

インダストリアル, メーカー, 製造業, 機械, エンジニア, 求人, 外資系

Job Ref: VY87ZN

Contract Type: Perm

Specialism: Industrial and Automation

Focus: Engineering Management

Industry: Manufacturing and Production

Salary: ¥7,000,000 - ¥11,000,000 per annum

Workplace Type: On-site

Experience Level: Mid Management

Language: English - Business level

Second Language: Japanese - Professional working

Location: Tokyo

Job Reference: VY87ZN-CA9D30B2

Date posted: 6 August 2025

Consultant: Bilol Rakhmetov